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CC2564MODA

ACTIVE

Bluetooth® 4.1 with Basic Rate, enhanced data rate, Low Energy (LE) module with integrated antenna

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Data sheet

CC2564MODA

ACTIVE
Data sheet Order now

Product details

Type Module, Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Operating temperature range (°C) -30 to 85 Rating Catalog
Type Module, Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Operating temperature range (°C) -30 to 85 Rating Catalog
QFM (MOG) 35 98 mm² 14 x 7
  • Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
    • CC2564MODA With Integrated Antenna
    • CC2564MODN With External Antenna
  • Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
    • FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
    • CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
    • Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
  • Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
    • CC2564MODA
      • Integrated Chip Antenna
      • Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
    • CC2564MODN
      • Single-Ended 50-Ω RF Interface
      • Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
    • Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Support of up to 10 Simultaneous Connections
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1.5 TX Power up to +10 dBm
    • –93 dbm Typical RX Sensitivity
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.
  • Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
    • CC2564MODA With Integrated Antenna
    • CC2564MODN With External Antenna
  • Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
    • FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
    • CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
    • Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
  • Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
    • CC2564MODA
      • Integrated Chip Antenna
      • Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
    • CC2564MODN
      • Single-Ended 50-Ω RF Interface
      • Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
    • Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Support of up to 10 Simultaneous Connections
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1.5 TX Power up to +10 dBm
    • –93 dbm Typical RX Sensitivity
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Hands-free profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Hands-free profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.
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Technical documentation

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Type Title Date
* Data sheet CC2564MODx Bluetooth® Host Controller Interface (HCI) Module datasheet (Rev. E) 16 Jan 2016
* Radiation & reliability report CC2564MODA Reliability Data – Reliability Estimate 25 Jun 2019
Selection guide CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 13 May 2022
Selection guide Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. B) 07 Mar 2022
Selection guide 無線連線技術選擇指南 (Rev. B) 07 Mar 2022
Selection guide 무선 연결 기술 선택 가이드 (Rev. B) 07 Mar 2022
Selection guide Wireless Connectivity Technology Selection Guide (Rev. B) 14 Feb 2022
Certificate CC2564MODA EC Declaration of Conformity (DoC) (Rev. A) 03 Mar 2021
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 15 Jan 2021
User guide CC2564x Demo Applications User's Guide PDF | HTML 17 Dec 2020
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 18 May 2020
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18 May 2020
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 07 Jan 2019
White paper Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) 16 Oct 2017
White paper Which TI Bluetooth® solution should I choose? 05 May 2017
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? 04 May 2017
More literature Streamline the challenges of RF design with certified wireless modules 25 Jan 2017
Technical article Maximize your IoT design with new dual-mode Bluetooth® + MSP432™ MCU bundle PDF | HTML 22 Dec 2016
Technical article Driving industrial markets with TI’s dual-mode Bluetooth® module PDF | HTML 05 May 2016
Technical article The dual-mode Bluetooth® module you’ve been waiting for is here PDF | HTML 17 Feb 2016
More literature Dual-mode Bluetooth CC256x solutions (Rev. C) 03 Feb 2016
User guide TI Dual-mode Bluetooth Stack on STM32F4 MCUs User Guide PDF | HTML 08 Jul 2015
User guide Dual-Mode Bluetooth CC2564 Module With Integrated Antenna Evaluation Board 07 Jul 2015
User guide CC2564MODA Evaluation Board Quick Start Guide 01 Jul 2015
White paper Three Flavors of Bluetooth: Which One to Choose? 25 Mar 2014

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